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  • Key Features
  • AMD X570 AORUS Motherboard with Direct 16 Phases Infineon Digital VRM, Fins-Array Heatsink, NanoCarbon Baseplate, Triple PCIe 4.0 M.2 with Thermal Guards, Intel® WiFi 6E 802.11ax, ESS SABRE HiFi 9218, AQUANTIA® 10GbE LAN+1GbE LAN, RGB FAN COMMANDER, RGB Fusion 2.0

    • Supports AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series/ 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
    • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
    • Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage
    • Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
    • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
    • Onboard Intel® WiFi 6E 802.11ax 2T2R & BT 5.2 with 2X AORUS Antenna
    • Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
    • AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed
    • Exclusive RGB FAN COMMANDER for Professional Casemoders
    • USB TurboCharger for Mobile Device Fast Charge Support
    • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
    • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
    • Front & Rear USB 3.2 Gen 2 Type-C™ Headers
    • Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
  • Specification
  • PU
    1. AMD Socket AM4, support for : Supports AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series/ 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
    (Please refer "CPU Support List" for more information.)
  • Chipset
    1. AMD X570
  • Memory
    1. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    2. Dual channel memory architecture
    3. Support for DDR4 5400(O.C.) / 5300(O.C.) / 5200(O.C.) / 5100(O.C.) / 4800(O.C.) / 4600(O.C.) / 4400(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C) / 3400(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules*
      * ECC memory (ECC mode) support varies by CPU
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules
    (Please refer "Memory Support List" for more information.)
  • Audio
    1. Realtek® ALC1220-VB codec
      * The front panel line out jack supports DSD audio.
    2. ESS SABRE9218 DAC chip
    3. High Definition Audio
    4. 2/4/5.1/7.1-channel
    5. Support for S/PDIF Out
  • LAN
    1. 1 x Aquantia GbE LAN chip (10 Gbit/5 Gbit/2.5 Gbit/1000 Mbit/100 Mbit) (LAN1)
    2. 1 x Intel® GbE LAN phy (10/100/1000 Mbit) (LAN2)
  • Wireless Communication module
    Intel® Wi-Fi 6E AX210
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
      * Actual data rate may vary depending on environment and equipment.
  • Expansion Slots
    Integrated in the CPU (PCIEX16/PCIEX8):
    1. AMD Ryzen™ 5000 Series/ 3rd Gen Ryzen™ Processors:
      1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
      1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x8 (PCIEX8)
    2. AMD Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series/ 2nd Gen Ryzen™ Processors:
      1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
      1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX8)
      * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
      * The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When using the AMD Ryzen™ 5000 series processors/3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors/3rd Generation AMD Ryzen™ with Radeon™ Graphics processors, the PCIEX16 slot operates at up to x8 mode.
    3. 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/1st Generation AMD Ryzen™ with Radeon™ Vega Graphics processors:
      1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
    Integrated in the Chipset (PCIEX4):
    1. 1 x PCI Express x16 slot, supporting PCIe 4.0/3.0 and running at x4
  • Multi-Graphics Technology
    1. Support for NVIDIA® Quad-GPU SLI™ and 2-Way NVIDIA® SLI™ technologies
    2. Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies
    Note: For AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series/ 3rd Gen Ryzen™/ 2nd Gen Ryzen™ Processors only.
  • Storage Interface
    Integrated in the CPU (M2A_SOCKET):
    1. AMD Ryzen™ 5000 Series/ 3rd Gen Ryzen™ Processors:
      1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support)
    2. AMD Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors:
      1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support)
    Integrated in the Chipset (M2B_SOCKET/M2C_SOCKET):
    1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 / 3.0 x4/x2 SSD support) (M2B_SOCKET)
    2. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 / 3.0 x4/x2 SSD support) (M2C_SOCKET)
    3. 6 x SATA 6Gb/s connectors
    4. Support for RAID 0, RAID 1, and RAID 10
      * Refer to "1-9 Internal Connectors," for the installation notices for the M.2 and SATA connectors.
  • USB
    Integrated in the CPU:
    1. 2 x USB 3.2 Gen 2/Gen 1 Type-A ports (red) on the back panel
    2. 2 x USB 3.2 Gen 1 ports on the back panel
    Integrated in the Chipset:
    1. 1 x USB Type-C™ port with USB 3.2 Gen 2 support, available through the internal USB header
    2. 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
    3. 3 x USB 3.2 Gen 2 Type-A port (red) on the back panel
    4. 2 x USB 3.2 Gen 1 ports available through the internal USB header
    Chipset+USB 3.2 Gen 1 Hub:
    1. 2 x USB 3.2 Gen 1 ports available through the internal USB header
    2. 2 x USB 2.0/1.1 ports available through the internal USB header
    Chipset+USB 2.0 Hub:
    1. 4 x USB 2.0/1.1 ports on the back panel
  • Internal I/O Connectors
    1. 1 x 24-pin ATX main power connector
    2. 2 x 8-pin ATX 12V power connectors
    3. 1 x OC PEG power connector
    4. 1 x CPU fan header
    5. 1 x water cooling CPU fan header
    6. 4 x system fan headers
    7. 2 x system fan/water cooling pump headers
    8. 2 x addressable LED strip headers
    9. 2 x RGB LED strip headers
    10. 3 x M.2 Socket 3 connectors
    11. 6 x SATA 6Gb/s connectors
    12. 1 x front panel header
    13. 1 x front panel audio header
    14. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
    15. 2 x USB 3.2 Gen 1 headers
    16. 1 x USB 2.0/1.1 header
    17. 1 x noise detection header
    18. 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
    19. 1 x Thunderbolt™ add-in card connector
    20. 2 x temperature sensor headers
    21. 1 x power button
    22. 1 x reset button
    23. 2 x BIOS switches
    24. Voltage Measurement Points
    *All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
  • Back Panel Connectors
    1. 1 x Q-Flash Plus button
    2. 1 x Clear CMOS button
    3. 2 x SMA antenna connectors (2T2R)
    4. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
    5. 2 x USB 3.2 Gen 2/Gen 1 Type-A ports (red)
    6. 3 x USB 3.2 Gen 2 Type-A ports (red)
    7. 2 x USB 3.2 Gen 1 ports
    8. 4 x USB 2.0/1.1 ports
    9. 2 x RJ-45 ports
    10. 1 x optical S/PDIF Out connector
    11. 5 x audio jacks
  • I/O Controller
    1. iTE® I/O Controller Chip
  • BIOS
    1. 2 x 128 Mbit flash
    2. Use of licensed AMI UEFI BIOS
    3. Support for DualBIOS™
    4. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Unique Features
    1. Support for APP Center
      * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
      @BIOS
      EasyTune
      Fast Boot
      Game Boost
      RGB Fusion
      Smart Backup
      System Information Viewer
      USB TurboCharger
    2. Support for Q-Flash Plus
    3. Support for Q-Flash
    4. Support for Xpress Install
  • Bundled Software
    1. Norton® Internet Security (OEM version)
    2. cFosSpeed
    3. XSplit Gamecaster + Broadcaster (12 months license)
  • Operating System
    1. Support for Windows 11 64-bit
    2. Support for Windows 10 64-bit
  • Form Factor
    1. E-ATX Form Factor; 30.5cm x 27.0cm
  • Remark
    1. Due to different Linux support condition provided by chipset vendors, please download Linux driver from chipset vendors' website or 3rd party website.
    2. Most hardware/software vendors may no longer offer drivers to support Win9X/ME/2000/XP. If drivers are available from the vendors, we will update them on the GIGABYTE website.

 

 

DESIGN CONCEPT

Innovative design, cutting-edge function, state-of-art aesthetics, sophisticated thermal design, next generation network connection ,Hi-Fi level audio system. X570 AORUS XTREME is the new definition of flagship motherboard.


GET READY FOR AMD RYZEN™ 5000 SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for latest AMD Ryzen™ 5000 Series Processors. The all-new design is a testament to GIGABYTE dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0, USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 5000 Series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.AMD Ryzen™ 5000, 4000, 3000, 2000 Series Compatible
 
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users' computing behaviors

Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi
Extreme Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, X570 AORUS XTREME is a true beast among motherboards.

 

 
16 Direct Digital Power Design
 

 
Power Architecture
 

 
2X Copper PCB
 

THERMAL REACTIVE ARMOR
X570 AORUS XTREME uses some unprecedented and innovative thermal design to ensure CPU, Chipset, SSD stability and low temperature under full loading application and gaming.

 

 
Thermal Design
 

 
Right-Angled Connector
 

 
NanoCarbon Baseplate
 

 
Noise Detection
 

 
16X Hybrid Fan Header
 

Unparalleled Performance
Hungry for better performance? X570 AORUS XTREME has full PCIe 4.0 design, supports high frequency memory, and full SSD thermal guard to make sure you get the maximum full system performance.

 

 
XMP 5400+
 

 
PCIe 4.0 Design
 

 
3X M.2 PCIe 4.0 x4
 

 
3X M.2 Thermal Guards
 

Next Generation Connectivity
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS XTREME provides all next generation network, storage, and WIFI connectivity to keep you up to speed.

 

 
10 GbE Base-T LAN
 

 
WIFI 6E 802.11ax
 

 
AORUS Antenna
 

 
USB TurboCharger
 

WIFI 6E Advantage
Spectrum congestion is huge problem in current WIFI environment nowadays because too many devices all use existing 2.4GHz and 5GHz spectrum, and it cause unreliable connection and slower speed. WIFI 6E is extended standard to WIFI 6, and it use dedicated 6GHz band that it provides not only brand new frequency to transfer data, but also spacious spectrum for future more devices. With WIFI 6E, users can enjoy faster connection and stronger signal than before.
Intel 802.11ax WIFI 6E
Intel latest Wireless solution 802.11ax WIFI 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6E
  1. Dedicated spectrum in 6GHz band for less interference
  2. 5.5X throughput than 802.11ac 1x1*
  3. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
  4. Network efficiency increase for better user experience
Definitive Aesthetics
GIGABYTE ID team designs X570 AORUS XTREME from the drawing board. After countless hours of conceptualizing ideas, fine tuning details and engaging in discussion, GIGABYTE has produced a board that is equal parts beast and beauty.

 

 
RGB FUSION 2.0
 

 
AORUS RGB FAN COMMANDER
 

HIFI AUDIO SYSTEM
Hi-Fi Audio System- As a Built-in Sound Card
For Hi-Fi Audio Solution, can be grouped into 2 parts.
Audio Signal Process, not distorted digital signal go through ESS 9218 Sabre DAC for Digital/Analog converter with 130dB SNR, 112dB THD+N and supports higher impedance up to 600 Ω headphone. Further, audiophile grade capacitor and gold plated audio jack ensures the non-compensated audio performance. Audio Signal Optimization, TXC Oscillator provides precise time triggers to Digital-Analog Converters. WIMA Capacitors to deliver crystal and balanced sound.
Audio Signal Process
Digital Audio
 
 
 
True Hi-Fidelity Music
Provides surround sound audio and enables DSD music playback
Digital / Analog Convert
 
 
 
ESS SABRE reference DAC 9218
  • Support QUAD DAC™
    to deliver superb 124dB DNR and -112dB THD+N.
  • True 2vrms outputs are capable of driving professional high impedance headphones and deliver professional line-level outputs.
  • Analog Volume Control
    delivers 130dB SNR at low listening levels by reducing noise as the audio signal decreases.
  • High-Res music
    Supports up to 32bit 192KHz PCM
Audio Signal Amplification
 
 
 
Audiophile Grade Capacitors
Deliver true acoustic sound
Crystal Sound Output
 
 
 
Gold Plated Audio Jacks
High resistance to corrosion and oxidation
 
Audio Signal Optimization
 
Precise TXC Oscillator
Provides precise time triggers to Digital-Analog Converters.
 
Audiophile Grade Capacitors
Famous WIMA capacitors are used as feedback signal processing to deliver crystal and balanced sound.
Ultra Durable
GIGABYTE is reputable for its durability and high quality manufacturing process. Needless to say, we use the best components we can find on the X570 AORUS XTREME and reinforce every slot to make each of them solid and durable.

 

 
3X PCIE Armor
 

 
4X Memory Armor
 

 
Solid Pin
 

 
Q-Flash Plus
 

GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. X570 AORUS XTREME bundled several useful and intuitive software to help users to control every aspect of motherboard.

 

 
BIOS
 

 
APP CENTER
 

 
Easy Tune
 

 
System Information Viewer
 

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